3d Integration Publications

Publications in 3D Integration

Explore the most influential research papers and scholarly works that have shaped 3D Integration. Use the concept filter below to focus on a specific sub-area of research.

3D Integration

Publications

95K

Citations

Showing yearly statistics from 2000-2026.

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	Year	Citations
Cramming More Components Onto Integrated Circuits Gordon E. Moore Proceedings of the IEEE EngineeringDevice IntegrationElectronic Design AutomationSmart ManufacturingElectronic Design	1998	5.8K
3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration Kaustav Banerjee, S.J. Souri, Pawan Kapur, Proceedings of the IEEE EngineeringVlsi DesignDevice IntegrationChip Design StrategyComputer Architecture	2001	1K
Demystifying 3D ICs: The Pros and Cons of Going Vertical W. Rhett Davis, John Wilson, Stephen Mick, IEEE Design & Test of Computers Crosstalk TolerancesAvailable 3DEngineeringVlsi DesignComputer Architecture	2005	827
Three-dimensional integration of nanotechnologies for computing and data storage on a single chip Max M. Shulaker, Gage Hills, Rebecca Park, Nature EngineeringDevice IntegrationNanocomputingSingle ChipData Storage	2017	809
Three‐dimensional numerical integration for electronic structure calculations P. M. Boerrigter, G. te Velde, J. E. Baerends International Journal of Quantum Chemistry Numerical AnalysisSpectral TheoryEngineeringThree‐dimensional Numerical IntegrationComputational Mechanics	1988	758
A precorrected-FFT method for electrostatic analysis of complicated 3-D structures Joel Phillips, Jacob White IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Numerical AnalysisEngineeringMechanical EngineeringComputational MechanicsInner Loop	1997	717
Three-dimensional integrated circuits Anna W. Topol, Douglas Charles La Tulipe, Liang Shi, IBM Journal of Research and Development EngineeringDevice IntegrationStacked LayersComputer ArchitectureIntegrated Circuits	2006	699
Die Stacking (3D) Microarchitecture Bryan Black, Daniel Pantuso, Paul A. Reed, Hardware Security3D Ic ArchitectureElectrical EngineeringMemory ArchitectureEngineering	2006	598
Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs Robert Patti Proceedings of the IEEE EngineeringComputer ArchitectureIntegrated CircuitsInterconnect (Integrated Circuits)Physical Design (Electronics)	2006	589
Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs Guruprasad Katti, Michele Stucchi, K. De Meyer, IEEE Transactions on Electron Devices Three-dimensional IcsEngineeringSilicon ViasIntegrated CircuitsSilicon On Insulator	2009	579
3D-Stacked Memory Architectures for Multi-core Processors Gabriel H. Loh ACM SIGARCH Computer Architecture News Manycore ProcessorEngineering3D-stacked Memory ArchitecturesThree-dimensional IntegrationWire Delay	2008	540
3D — A proposed new architecture for solid-state radiation detectors S.I. Parker, C.J. Kenney, J. Segal Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment Accelerator TechnologyEngineeringRadiation DetectionPhysicsApplied Physics	1997	520

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